COG LCD Display Modules

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price: Negotiable
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Delivery term: The date of payment from buyers deliver within days
seat: Beijing
Validity to: Long-term effective
Last update: 2017-09-03 11:38
Browse the number: 47
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Product details
Chip-On-Glass (COG) is a flip chip bonding method which
is used for connect assembly of bare integrated circuits
on glass substrate directly by using Anisotropic Conductive Film .
The pitch of the IC bumps can be scaled down according to customers'
requirements . This method reduces the assembly area to the highest
possible packing density, which especially important to those
applications that space saving is crucial. It allows a
cost-effective mounting of driver chips because integrating
flex PCB is no longer required. The IC is bonded directly onto
the glass substrate and is suitable for handling high-speed or high-frequency signals.
www.blazedisplay.com
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